There is no additional information available for this event yet.The event date is unknown.Supplemental report(s) will be filed as the information becomes available.The device has been returned and a device evaluation completed for it.The manufactured date is not known.The user¿s complaint of torn bending section cover is confirmed.Upon inspection, it was noted that the device bending section cover was ripped off, likely by handling during reprocessing.In addition, upon the leak test being performed, the device had a heavy leak coming from the channel.There was also a large tear on the wall of the channel which was observed when boroscoped.There was no image issue with the device.In conclusion of the evaluation, the likely cause of the issue is handling of the device during reprocessing.
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