Original submission narrative: the device referenced in this report has not been returned to siemens for evaluation.If the device is received at a later date, this report will be supplemented.Follow-up narrative: relevant tests/other relevant history: not applicable, no adverse event.Implant/explant date: not applicable, not an implant.Device manufacture date: not available.Investigation: the complaint was investigated for bad resolution at exams, and transducers heating in abnormal conditions.The unit was never received at the factory.Per order management, the rma was cancelled, and the country/customer is keeping the system.The unit is not currently planned to be returned for failure analysis.There is insufficient information provided by the complainant to determine root cause.Speculation on root cause could be a failure in the thermal protection in the transducer and the system.However these are monitored by the rc board in the system, and the voltages used in transmission are monitored by fptop process controls and will shutdown if there is any difference in the power output.This unit was retained by the country, and was not returned for failure analysis.This was a customer education issue; no further follow up was noted after the request for actual thermal measurements of the probe were requested, but not received).Complaint reference #: (b)(4).
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It was reported that during equipment testing for a routine but unspecified exam, the transducer became very hot and the image quality was reported to be bad.The report stated that the issue was intermittent and the transducer did not warm up at first so temperature measurement was performed.When the temperature reached approximately 34 degrees, the system hang up and a us_img_29 and 20 error messages were displayed.The exam was delayed because the user had to make adjustments to the image quality.Although there was no loss of data, the exam was repeated when the system was restarted.There was no patient adverse event reported.No additional information was provided.
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