Model Number N/A |
Device Problems
Tear, Rip or Hole in Device Packaging (2385); Device Packaging Compromised (2916)
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Patient Problem
No Patient Involvement (2645)
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Event Date 06/04/2018 |
Event Type
malfunction
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Manufacturer Narrative
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(b)(4).Product has been received by zimmer biomet and the investigation is in process.Once the investigation has been completed, a follow-up mdr will be submitted.
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Event Description
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It was reported that upon inspection at warehouse, the implant was found to be through the inner and outer packaging.Attempts have been made, and no further information has been provided.
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Event Description
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No additional information available.
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Manufacturer Narrative
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This follow-up report is being submitted to relay additional information.Complaint sample was evaluated and the reported event was confirmed.Visual evaluation of the returned product identified that the stem has protruded through the inner blister, outer blister and also the outer carton.Device history record was reviewed and no discrepancies were found.Root cause can be attributed to transit damage.If any further information is found which would change or alter any conclusions or information, a supplemental will be filed accordingly.Zimmer biomet will continue to monitor for trends.
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Search Alerts/Recalls
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