The device was returned and evaluated.During returned instrument testing evaluation (rite), an external inspection was performed and no issues were noted.Functional and electrical testing were performed.Rite electrical testing failed the ground bond test which revealed the device was out of specifications for the resistance measured.The inspection revealed the cause of the failure was due to a loose door ground and door frame connection.A service history review revealed no indication that the parts replaced during servicing caused or contributed to the reported event.The device was sent to service for rework and part replacement.Should additional relevant information become available, a supplemental report will be submitted.
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