As the device was received in a condition was contradictory to the complaint description.The pipeline flex device coil tip and pushwire was found separated from the hypotube at the distal hypotube weld (solder joint).This condition was not reported during the time of the event.As the device returned for analysis found, the pushwire coil tip and braid were partially pushed outside of the catheter tip with the exposed braid end frayed.The pushwire was retracted out of the microcatheter with no resistance encountered.No damages or irregularities were found with the pipeline flex pushwire; however, the coil tip and pushwire was found separated from the hypotube at the distal hypotube weld (solder joint).The braid subassembly and detached pushwire were pulled out of the distal end of the catheter with resistance encountered.Once removed from the catheter and hydrated, the distal and proximal ends of the pipeline flex braid fully opened, and the distal end of the braid was confirmed to be frayed while the proximal end had no damage.The tip coil was found stretched.The ends of the detached pushwire and the separated hypotube were sent out for sem (scanning electron micrographic) / eds (energy dispersive spectroscopy) elemental analysis.The elemental analysis of the detached pushwire end showed presence of tin (sn).Based on the reported information and analysis findings, we were unable to determined the cause of the event.From the damages seen on the catheter body (crush/stretching/accordioning), pipeline flex braid (frayed distal end) and pusher (coil tip stretching/separation of solder joint); it appears there was high force used.It is likely these damages occurred when the customer attempted to advance and retract the pipeline flex through the marksman catheter against resistance.Separation can occur if excessive force is used exceeding the tensile strength of the material.Regarding the solder joint separation issue, in addition to excessive force, separation can occur due to inadequate solder/tinning.As the analysis showed presence of soldering material (tin); thereby indicating that the soldering was conducted.If information is provided in the future, a supplemental report will be issued.
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