During a procedure, a csi peripheral orbital atherectomy device (oad) and viperwire guide wire were used to treat lesions located in the superficial femoral (sfa) and popliteal arteries, which were 85-90% stenotic.The lesions were initially wired with non-csi guide wires, and an exchange was performed for the viperwire.Three treatment passes were performed in each lesion, the oad was removed, and imaging showed the tip of the viperwire guide wire had fractured.The user stated the oad had not spun near the spring tip of the viperwire.The lesions were ballooned, and the vessels had good flow through the posterior tibial (pt) artery.The fractured portion of the viperwire had migrated down the leg, and it was determined that the vessel was too small to attempt retrieval.Since there was good flow, the fragment was abandoned in the vessel.The patient was discharged home on (b)(6) 2020.
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Updated fields: b4, g4, g7, h2, h3, h6, h10.The reported guide wire was received for analysis.The guide wire was fractured, and the fragment was not returned.Adhered adhesive residue from the proximal strain relief was proximal to the fracture site.Two kinks were observed, and there was rotational surface wear on one of the kinks.Scanning electron microscopy revealed the guide wire fractured, due to excessive torsional forces.This damage was consistent with the spinning oad driveshaft making contact with the spring tip.The root cause of the guide wire fracture was considered user error from spinning into the spring tip.The oas instructions for use states, "never advance the orbiting crown to the point of contact with the guide wire spring tip.Distal spring tip detachment and embolization may result.Make sure there is a minimum of 10 cm between the guide wire spring tip and the distal end of the shaft".At the conclusion of the device analysis, the reported event of a guide wire fracture was confirmed.The material inspection report for this guide wire lot number has been reviewed.No issues or discrepancies were noted, during this review that would have contributed to the reported event.The device met material, assembly, and quality control requirements.Csi id# (b)(6).
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