This supplemental report is being submitted to provide the legal manufacturer¿s investigation.The legal manufacturer performed an investigation.The device history records for this device were reviewed and all records indicated that the product was manufactured according to all applicable procedures and met final product release criteria.No abnormalities were found.The root cause of the issue could not be conclusively specified.It is likely that the event was caused by the detection of an abnormality in the internal circuit and it is likely the cause of the abnormality in the internal circuit was that the pressure sensor mounted on the main board had failed.It is likely the cause of the failure of the pressure sensor mounted on the main board was one of the following process abnormalities.Oxygen entered the device and the electrode part of the pressure sensor was oxidatively corroded.Due to the oxidative corrosion, the wiring inside the pressure sensor was peeled off.Foreign matter (epoxy) was attached due to a mistake in mounting the parts, and the wiring inside the pressure sensor was peeled off due to the adhesion of the foreign matter (epoxy).The instruction for use (ifu) states the following guidelines: chapter 7.1, "how to identify the cause of an abnormality and how to deal with it" has the following description.· abnormal content: all leds are off · cause: an abnormality has been detected in the internal circuit of this product.
|