A visual inspection was performed on the returned device.The reported tear, rip or hole in device packaging could not be tested due to the condition of the returned chipboard box.A review of the lot history record identified no manufacturing nonconformities issued to the reported lot that would have contributed to this event.Additionally, a review of the complaint history identified no similar incidents from this lot.A conclusive cause for the reported tear, rip or hole in device packaging could not be determined.There is no indication of a product quality issue with respect to manufacture, design, or labeling.
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