This remediation mdr was generated under protocol b10010116, as a result of warning letter cms# (b)(4).No problems or issues were identified during this device history record review.A product sample was received for evaluation.Visual and functional testing were performed.Pictures attached in investigation: 2 images were provided.One (1) sample was received in used conditions, without its original packaging.The sample was tested on leak test.The test was performed under water symmetry and leak test method.During the test, a leak was found in the cuff.The cuff was inspected using a digital microscope with a scale of 200x, to observe better the shape of the pinhole found during leak test.The hole was observed with a circular shape with flash in the periphery.The root cause of the reported issue was found to be most probable that the damage occurred after the product left the manufacturing facilities.No corrective actions were taken since the investigation did not reveal that the defect was caused during the manufacturing process.
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