This remediation mdr was generated under protocol (b)(4), as a result of warning letter cms# (b)(4).No problems or issues were identified during the device history record review.Two samples were received without the original packaging, decontaminated, and inside a plastic bag.Visual inspection confirmed that there was a hole in the circuit which confirmed the failure mode reported, while no defect was detected in the other sample.During the packaging test it was concluded that the failure reported could not be reproduced in the manufacturing process.The root cause cannot be associated with the manufacturing process since the failure reported could not be reproduced using the tools from assembly and packaging process.Therefor the damage (hole) was after the product left the facility.No corrective actions were taken since the investigation did not reveal that the defect was caused during the manufacturing process.D3, d4 (udi), g2 and g5 were unknown.
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