The reported event of lead damage was confirmed.As received, a complete lead was returned in one piece.Visual inspection found the connector pin and molded cap were pulled out of the connector assembly, stretching the inner coil consistent with damage cause during the procedure.Evidence of solvent bonding were observed around the molded cap and inside the connector assembly.The cause of the reported event was consistent with damages occurring while applying forces between the lead body and pin resulting in the connector pin being pulled out and becoming separated from the connector assembly, consistent with procedural damage.A review of the device history record (dhr) confirmed that no issues were identified related to this reported event,.
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