A review of the device history record could not be conducted because a lot number was not provided.Manufacturing records are routinely reviewed prior to the release of product to ensure process and product compliance.Because the sample was not provided by the customer, the sample evaluation could not be conducted and the issue reported by the customer could not be confirmed.Because the sample has not been received the failure mode could not be confirmed; therefore, the root cause was not identified for this incident.However, due to previous evaluations and samples reported with this failure mode the potential root cause that may cause this condition could be lack of solvent during the bonding process.Since this is a manual operation the reported condition could be originated due to a lack of solvent (thf) between the tip connector to bolus tip and hollow rod connector.The production personnel were notified about the reported condition.The acceptable quality limit level for sub assembly inspection was moved from normal to tighten and a quality alert was posted to reinforce the manual assembly and to alert the operators about the most critical sections that must be covered with enough solvent.If additional information is received warranting further analysis, the investigation will be resumed.This complaint will be used for tracking and trending purposes.
|