The device was returned for analysis.The reported packaging tears, rips, hole in device packaging (crushed chipboard box) was confirmed.A review of the lot history record identified no manufacturing nonconformities issued to the reported lot that would have contributed to this event.Additionally, a review of the complaint history identified no other incidents from this lot.The investigation was unable to determine a conclusive cause for the reported tear, rip, or hole in device packaging; however, factors that could contribute to packaging tears, rips, holes (crushed chipboard box) include, but are not limited to, manufacturing damage, damaged during shipping, inadequate storage and product damage during handling by user.There is no indication of a product quality issue with respect to manufacture, design or labeling.E1: updated from unknown to eva maria cubillo.E3: updated from physician to other health care professional.
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