This report is being submitted as follow up no.1 to provide the device return date in section d9, and to provide the completed investigation results.Visual inspection of the actual sample found that the sampling line and the thermistor probe had been damaged as in the provided image.The provided image was confirmed.It was found that the sampling line connected to the venous blood inlet port of reservoir was damaged.In addition, although there was no description in the reported issue, it was found that the thermistor probe was damaged at the root.Magnifying and electron microscopic inspections of the damaged surface of actual sampling line found that the damaged surface had streak patterns.Therefore, it was inferred that the sampling line was damaged (torn) due to some force.Magnifying and electron microscopic inspections of the damaged surface of actual thermistor probe found that the damaged surface had a smooth shape.Therefore, it was inferred that the damage was caused by an instantaneous force.We have experienced that each similar damage occurred when external force was applied to the product.Shock force was applied to a factory-retained sampling line.It was found that a part of the sampling line was damaged (torn).It was also found that the damaged surface had streak patterns, which was similar to that of the actual sample.Shock force was applied to a factory-retained thermistor probe.It was found that the damaged surface had a smooth shape, which was similar to that of the actual sample.Review of the manufacturing record and the shipping inspection record of the actual sample confirmed that there was not any anomaly in them.A search of the complaint file found no other similar report with the involved product code/lot number combination from the same facility.Based on the investigation result, since the sampling line connected to the venous blood inlet port of reservoir and the thermistor probe was damaged, it was likely that the product was damaged due to some force applied during handling of the product, such as the distribution process and the storage environment.However, it was not possible to identify when the product was damaged from the condition of the actual sample, and it was not possible to clarify the cause.
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