The device history record was reviewed, and no abnormal process conditions were present during the manufacturing of the product that could have led to the reported issue.Two photos were provided for analysis but the reported issue could not be confirmed.No physical samples were provided for further analysis.A gemba was carried out in the manufacturing process.Current process and controls were found to be followed correctly, including subassemblies, finished product assembly, packaging, and product inspections.No abnormal conditions were found that could trigger the reported condition.The current controls includes a 100% visual inspection by production personnel.In addition, a qc sampling inspection is performed to ensure that product is free from missing components, damaged components, inappropriate assembly and contamination.Based on the present information, an exact root cause cannot be determined.No action plan is deemed required at this time.The investigation will be reopened if a sample is received at a later date.This complaint will be used for tracking and trending purposes.
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