A visual, functional and dimensional inspection of the product involved in the complaint could not be conducted since the product was not returned.A review of mfg event log: shows no issues that may have contributed to any quality issues reported.All process parameters were within specification.All in-process qa inspections were acceptable.Post sterility and package integrity tests shows one non-conformance that may have an impact on the quality issue reported.Non-confirming material was sorted for a defect, re-inspected, and found to be acceptable per internal specification.No sample available from the customer to investigate.Teleflex will continue to monitor feedback from the customers on issues related to pin hole on package found at inspection on adaptor products.No sample available from the customer to investigate.Complaint not confirmed.Root cause unk.
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