(b)(4).Evaluation summary: the device was returned for analysis and the deployment issue was confirmed.A glue drop was found at the guide wire exit notch and was noted to be part of the normal manufacturing process.It would not have contributed to the reported deployment difficulty.Based on visual and functional analysis of the returned device, there is no indication of a product quality issue with respect to manufacture, design or labeling.A definitive cause for the deployment difficulty cannot be determined.A review of the lot history record identified no manufacturing nonconformities issued to the reported lot that would have contributed to this event.Additionally, a review of the complaint history identified no other incidents from this lot.Based on the reviewed information, there is no indication the issue was caused by or related to the design, manufacture or labeling of the device.
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