Visual analysis found a cut at the tyvek side of the package.The section of the package found cut has its appearance without irregularities and the cut looks very clean.The evaluation concluded that the damage found was most likely caused with an unknown/sharp instrument since the cut looks clean and the section of the package found cut appears to have no irregularities.During its manufacturing process the product is inspected in regards to its integrity, however there is no control in how the units are handled in the field.Therefore, the most probable root cause is "handling damage" since it was concluded that the way in which the unit was handled and manipulated during preparation may have contributed to the issue noted.The device history record (dhr) review found the device met all manufacturing specifications.A search of the complaint database revealed that no similar complaints exist for the specified lot.
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