(b)(4).Batch # p56j5d.Per photographic evaluation: upon visual inspection of the picture, the tyvek can be noted to be separated from the blister.However, no definitive conclusion could be reached as to the origin of the damage as the device was not returned for analysis.The photos do not provide enough evidence to determine root cause.Hands on analysis should provide the evidence necessary to confirm the root cause.Device analysis: the analysis results found that an ec60 device was returned inside its package partially opened.Upon visual inspection, it was observed that the blister and the tyvek from the packaging were damaged; the blister was found to be bent and the tyvek was noted to have a hole.The sterility was compromised.Due to the damages found on the packaging, a possible cause for these conditions is due to improper handling during transit or storage; it appears that the package hit a pointy surface and this caused the reported event.All ees product is 100% inspected prior to release.The information you provided is compiled monitored and reviewed on a routine basis for any associated trends.The lot history record was reviewed and no defects, ncr¿s or protocols related to the complaint, were found during the manufacturing process.The batch history record was reviewed and no defects, ncr¿s or protocols related to the complaint, were found during the manufacturing process.
|