The homechoice device was returned and evaluated by the product analysis lab (pal).The manufacturing record review was performed and no issues were found during the previous related to the reported problem.An external inspection was performed and the device passed, along with all of the functional testing.During evaluation, the ground bond failure analysis revealed that the device was out of specified limits for the resistance measured during the returned instrument testing evaluation electrical testing.Pal reconnected the ground wire to be within specification.The inspection revealed the cause of the failure to be ground wire from the door assy to the ground stud was not connected to the ground stud.The device was sent for service.Should additional relevant information become available, a supplemental report will be submitted.
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