All available information was investigated and the reported tear, rip or hole in device packaging was confirmed during return device analysis.A review of the lot history record revealed no manufacturing nonconformities issued to the reported lot.Additionally, a review of the complaint history identified no similar lot specific product issue.All available information was investigated and a definitive cause for the reported tear, rip or hole in device packaging could not be determined in this incident.There is no indication of a product quality issue with respect to manufacture, design or labeling.
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