The subject device in this report has not been returned to omsc for evaluation.Omsc reviewed the manufacturing history (dhr) of the subject device and confirmed no irregularity.Since there was no delivery of the subject device, the cause could not be determined, but it is presumed from the phenomenon that the pressure sensor mounted on the main substrate was failing.The cause of the failure of the pressure sensor mounted on the main board is presumed to be due to any of the following process errors.Oxygen entered the device and the electrode of the pressure sensor was oxidized and corroded.The wiring inside the pressure sensor was peeled off due to the oxidation corrosion.Because foreign matter had adhered to the mounting of the component due to a mistake, the wires inside the pressure sensor had peeled off due to adherence of the foreign matter.If additional information becomes available, this report will be supplemented.
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