(b)(4).The sample was returned for evaluation.A visual exam was performed and there were no major defects observed.Functional testing was performed and the unit was connected to 120vac.The unit did not pass the initial power connect test or the power-on self-test (p.O.S.T.).The power button was not illuminating and when pressed , the unit did not power on.The unit was opened, and it was noted that the power supply board was burnt in the back middle of the board.Additionally , one of the power harnesses broke during removal of the power supply board, so it was not possible to replace the burnt board with a known good lab inventory board.R & d was contacted and they presented a possible root cause related to the melted solder spread out on the board, which could cause the unit to overheat and fail.The board was sent back to the pcb supplier for further testing.The supplier investigation revealed a possible root cause related to one of the burnt components on the board puncturing and therefore shorting with the metal base plate located under the board inside the unit.This could explain why the board was found to be functioning correctly during initial manufacturing, but later failed shortly after assembly within the unit.The shorting could have also been caused by insufficient distance between the board and the base plate, or potentially by longer leads being left on the bottom of the board which would have been able to touch the base plate after assembly.Multiple potential root causes have been presented by r & d as well as the supplier.Therefore, it could not be determined exactly how or when the board experienced the failure based on the results of this investigation.The root cause will be listed as undetermined.
|