All available information was investigated, and the reported tear, rip or hole in device packaging was confirmed via device analysis.A review of the lot history record revealed no manufacturing nonconformities issued to the reported lot that would have contributed to this event.Additionally, a review of the complaint history identified no similar incidents reported from this lot.Based on available information, the cause of the reported hole in the device packaging could not be determined.There is no indication of a product quality issue with respect to manufacture, design, or labeling.
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