This remediation mdr was generated under protocol b10010116, as a result of warning letter cms# 617147.No problems or issues were identified during this device history record review.One sample was received, decontaminated; the sample was received in used condition with its open original package.During the functional testing, the unit sample was found occluded.The failure mode reported was confirmed.The root cause is excess solvent in the component bonding operation.Awareness notification was made to production personnel for the occlusion failure mode.
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