Visual and functional analysis was performed on the returned device.The reported signal calibration failure was unable to be confirmed due to the returned condition of the device (sensor chip damage/separation).A review of the lot history record identified no manufacturing nonconformities issued to the reported lot that would have contributed to this event.Additionally, a review of the complaint history revealed no indication of a lot specific product quality issue.The investigation was unable to determine a root cause for the reported signal calibration failure.The device was returned with the sensor chip assembly fractured resulting in a separation, which prevented further functional testing of the guidewire.The sensor chip separation could have caused or contributed to the reported signal calibration failure; however, the cause of the damage appears to be caused by use condition(s) or handling technique(s) employed prior to use or occurred from post-use handling or shipping conditions.The guidewire was able to pass all tests and check points during manufacturing, indicating that the chip was not damaged or separated during the manufacturing process.There were also kinks/bends noted to the proximal tube and corewire of the guidewire, which were determined to be unrelated to the reported issue and were likely caused by post-use handling or shipping conditions.There is no indication of a product quality issue with respect to the design, manufacture, or labeling of the device.
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