This report is being supplemented to provide additional information based on the approved final investigation.A review of the device history record revealed that the device was shipped in accordance with the specifications and had no nonconformity at manufacturing.Based on the results of the investigation, it was considered that the suggested event might have occurred due to several stressors applied to the insertion section.These stressors included physical stress, such as scratching or hitting the insertion section; chemical stress from conducting reprocessing not recommended in the ifu (reprocessing manual); and stress from poor storage environments, such as exposure to direct sunlight, high temperatures, high humidity, x-rays, or ultraviolet rays and since the device was not returned for evaluation, the definitive root cause of the reported issue could not be determined.Country of occurrence was added (please refer to g2).Olympus will continue to monitor field performance for this device.
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