No evidence of externally induced markings (like scratching), inherent weak spots (like inclusions) or flaws from the manufacturing process that could have contributed to the failure were found on the core wire.From the visual examination and analysis of sem images it is likely that the fracture was caused by mainly rotational force and then last section of the fracture occurred due to tensile and rotational force.A review of the device history record confirmed that the device was manufactured according to (b)(4) specification.
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