No evidence of external induced markings (like scratching), inherent weak spots (like inclusions) or flaws from the mfg process that could have contributed to the failure were found on the core wire.From the visual examination and analysis of sem images it is likely that the heavy bending and rotational/torsional force could have caused the failure.Fracture surface features indicate that the fracture would have occurred due to ductile nature.A review of the device history record confirmed that the device was manufactured according to sjm specification.
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