This report is based solely on device analysis.No information to suggest a device related adverse event or product problem was received.If additional relevant information is received, a supplemental report will be submitted.Product event summary: analysis found the device shut down during testing and caused a system crash.The main printed circuit board assembly was realigned, retested, and then failed due to an error caused by the tester.Analysis also found the battery wire insulation was pinched (wire insulation not compromised) and the display wire insulation was pinched (wire insulation not compromised).(b)(4).
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