(b)(4).Batch t5a59c.Investigation summary: the analysis results found that psee60a device was returned inside its package opened.Upon visual inspection, it was observed that the blister and tyvek from the packaging were damaged.The blister was noted to be broken.It was noted to have a hole in the tyvek, the hole was noted to be from the outside in.Due to the damages found on the packaging, a possible cause for these conditions is due to improper handling during transit or storage; it appears that the package hit a pointy surface and this caused the reported event.The reported complaint was confirmed.All ees product is 100% inspected prior to release.The information you provided is compiled monitored and reviewed on a routine basis for any associated trends.A manufacturing record evaluation was performed for the finished device lot t9254n number, and no non-conformances were identified.A manufacturing record evaluation was performed for the finished device batch t5a59c number, and no non-conformances were identified.
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