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(b)(4).Batch # n4m93g.Investigation summary: the analysis results found that a pn150 device was returned inside its original package.Upon visual inspection, it was noted that the tyvek was adhered to the blister in the easy opening area.Possible causes of tyvek delamination are tyvek quality, seal strength, or opening technique; however, no conclusion could be reached as to what may have caused this condition.A manufacturing record evaluation was performed for the finished device lot number, and no non-conformances were identified.
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