Updated data: b4, d9, g3, g6, h2, h3, h6, h10.Device evaulation conclusion: the guide wire was received at csi for analysis.Analysis did not reveal any damage with the guidewire or spring tip, no fractures were observed.At the conclusion of the device analysis investigation, the reported fracture could not be confirmed through analysis.The material inspection report for this guide wire lot number has been reviewed.No issues or discrepancies were noted during this review that would have contributed to the reported event.The device met material, assembly, and quality control requirements.Csi id: (b)(4).
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