|
The guide wire was received at csi for analysis.Visual examination revealed the guide wire was fractured, and that the spring tip was intact with no damage observed.Scanning electron microscopy analysis revealed evidence of fatigue and a large crack down the middle of the guide wire, which was consistent with a fracture due to use of the wire in an unusually elevated stress environment.At the conclusion of the device analysis investigation, the report that the guide wire had fractured was confirmed, however the exact root cause of the fractures could not be determined.The material inspection report for this guide wire lot number has been reviewed.No issues or discrepancies were noted during this review that would have contributed to the reported event.The device met material, assembly, and quality control requirements.(b)(4).
|