Product analysis findings: the pipeline flex w/ shield device was found stuck within the catheter when attempting to advance or retract out.The catheter was cut to remove the pipeline flex w/ shield device.Dried blood was found within the catheter.The inner diameter of the catheter was measured to be 0.027¿ proximally which is within specification and compatible for use with the pipeline flex w/ shield.The distal inner diameter could not be measured as it was damaged prior/during the extraction.The pipeline flex w/ shield pusher core wire was found kinked between ~40.2cm and ~50.9cm from the proximal end.The hypotube was found stretched with the ptfe shrink tubing broken at this location.No damages were found with the proximal bumper.The distal delivery wire was separated from the hypotube proximal to the wire weld.The resheathing pad and pad restraints were found intact.The dps sleeves, dps restraints and tip coil were separated from the distal delivery wire.Once fully deployed out of the micro catheter, both ends of the braid were found fully opened, damaged and frayed.The separated distal wire was sent out for sem/eds testing.No other anomalies were observed.Based on the analysis findings, the customer report of ¿pushwire kink/damage¿ and ¿lockup/resistance at distal segment of catheter¿ were confirmed as the pipeline flex w/ shield device was returned stuck within the catheter.From the damages found on the catheter (accordioned/flattened) pusher (kinked), hypotube (stretch), dps sleeves (break), tip coil (break) and braid (damaged/frayed), it appears high force is used.It is possible these damages occurred when the customer attempted to retrieve the pipeline flex shield through the catheter against the reported resistance.Possible contributors towards the failure are patient vessel tortuosity or lack of continuous flush.The distal wire of the pipeline flex delivery system was possibly detached due to the solder tensile failure when attempting to retract the pipeline flex against resistance.A review of the manufacturing process did not uncover any deficiencies with regards to the soldering process.Proper soldering technique and surface preparation (tinning) were well defined and documented appropriately in the associated manufacturing procedures.In addition, the elemental analysis conducted through scanning electron micrographic (sem) / energy dispersive spectroscopy (eds) showed presence of soldering material (tin); thereby indicating that the soldering was conducted.The proof load of 2.5n performed on 100% of the devices (section starting with hypotube solder to distal pad solder joint).There was no non-conformance to specification that led to the detachment issues.There is no indication that the event is related to a potential manufacturing issue.If information is provided in the future, a supplemental report will be issued.
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