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The device was returned for analysis.The reported deformation due to compressive stress could not be confirmed as they were not returned for analysis.A review of the lot history record identified no manufacturing nonconformities issued to the reported lot that would have contributed to this event.Additionally, a review of the complaint history identified no other incidents from this lot.The stent delivery system (sds) was returned coiled in the coil dispenser with the balloon tightly folded.There was a kink in each ring of the coil dispenser at two locations.The kinks in the rings of the coil dispenser lined up consistently to the kinks and breaks on the hypotube distal to the strain relief and a break and a pinch to the inner and outer member distal to the guide wire exit notch.The investigation determined the reported difficulties appear to be related to the noted packaging damage (kinked coil and crushed chipboard box) identified during return analysis.The investigation was unable to determine a conclusive cause for the noted chipboard box and coil damage; however, factors that could contribute to packaging damage (chipboard box and coil damage) include, but are not limited to, manufacturing damage, damaged during shipping, inadequate storage and product damage during handling by user.There is no indication of a product quality issue with respect to manufacture, design or labeling.
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