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The reported guide wire was received at csi for analysis.A visual examination confirmed that both the distal section and the spring tip solder bond were fractured, and that the spring tip solder bond was damaged.Scanning electron microscopy analysis showed evidence of fatigue, without any indication of excessive wear on the surface of the wire.Analysis determined that this was due to an extreme and abnormal stress condition, however the cause of this condition was not identified.At the conclusion of the device analysis investigation, the report that the guide wire fractured was confirmed, although the root cause of the fractures could not be determined.The material inspection report for this guide wire lot number has been reviewed.No issues or discrepancies were noted during this review that would have contributed to the reported event.The device met material, assembly, and quality control requirements.Csi id: (b)(4).
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The diamondback peripheral orbital atherectomy device (oad) was operated for ten treatment passes without issue.After removal of the viperwire guide wire, it was observed that a portion of the guide wire remained in the patient.A snare device was used to retrieve the fragment, however part of the wire tip could not be retrieved and it was left in vivo.The patient was reported to be in stable condition.
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