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Upon receipt the lead was found cut 15cm distal to the is-1 connector pin into two segments.A proximal and a distal lead fragment were received for analysis.An extraction aid was found on the distal fragment, it is reasonable to assume that the lead was cut during the extraction procedure.The analysis showed that the insulation was found abraded through 19cm and 11cm proximal to the lead tip.This damage most likely resulted due to constant friction against another implantable device such as a nearby lead.A thorough subsequent root cause analysis led to the assumption that the lead might had dislodged due to the above mentioned constant friction, resulting into the observed exit block and electrical issues.Diagnostic images clarifying this assumption were not available.Should additional information or diagnostic images become available, the investigation will be updated.Further damages such as cuts into the insulation 37cm proximal to the lead tip, probably resulted from the extraction procedure.The manufacturing process for this device was re-investigated.All production steps had been performed accordingly.There was no sign of any inconsistency during the manufacturing process.In conclusion, the analysis did not reveal any sign of a material or manufacturing problem.
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