| Model Number |
H702475 |
| Medical Device Problem Code |
Thermal Decomposition of Device (1071)
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| Health Effect - Clinical Code |
No Clinical Signs, Symptoms or Conditions (4582)
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| Date of Event |
06/21/2021
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Type of Reportable Event
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Malfunction
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Additional Manufacturer Narrative
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One ensite¿ precision¿ link sensor enabled was received for evaluation.Visual inspection of the connectors and chassis revealed no physical damage.A small nick was observed at the front panel.The precision link was powered on and audible beeps were observed indicating a successful boot up.The field reported event was confirmed as communication could not be established.Internal inspection verified all mounting hardware were secured and a thermal scent was observed.Inspection at the system controller unit (scu) board verified a thermal event occurred at integrated chip lm317.The root cause was isolated to the scu board.The device history record was reviewed to ensure that each manufacturing and inspection operation was performed.Based on the information provided to abbott and the investigation performed, the root cause was isolated to a thermal event on the system controller unit board.
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Event or Problem Description
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This report is being submitted based on analysis which revealed a thermal event occurred.
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Search Alerts/Recalls
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