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H3, h6: it was reported that during a thr the handle of a sl-plus/sbg/ipa mia offset adapter 40mm broke.The device, used in treatment, was returned for investigation.Upon visual inspection, the fracture at the connection between the contact pin and the body of the adapter could be confirmed.Apart from that, the device shows normal signs of usage such as small dents and scratches.A review of the production documentation did not reveal any deviation from the standard operating procedure.No additional complaint with the batch in question was reported so far.The severity and the failure mode are covered through the smith & nephew risk management.There is no indication that the reported device failed to meet manufacturing specifications upon release for distribution.However, based on the performed investigations, the relationship between the reported event and the device was confirmed.This instrument is designed to hold and guide the detachable rasps for broaching.It is therefore subjected to repeated impact forces via the modular knock plate or the pneumatic woodpecker.Previous investigations demonstrated, that under specific circumstances, this device may fracture during impaction.An optimized design of the device has been released in order to reduce the occurrence of this issue.According to document "processing (cleaning, disinfection and sterilization) of instruments from smith & nephew orthopaedics ag", all instruments must be inspected and controlled for proper functioning after cleaning/disinfection.Furthermore, instruments should only be used in their original condition.This version of the device will be monitored for similar issues.The returned device will be discarded.
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