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This report is being submitted in pursuant to the provisions of 21 cfr, part 803.This report may be based on information which has not been able to investigate or verify prior to the required reporting date.This report does not reflect a conclusion by depuy mitek or its employees that the report constitutes an admission that the device, depuy mitek, or its employees caused or contributed to the potential event described in this report.If information is obtained that was not available for the initial medwatch, a follow-up medwatch will be filed as appropriate.Udi: (b)(4).Investigation summary this complaint was created to address two extra devices received under (b)(4).The two vapr 3.5mm side str -ea (extras) were returned to manufacturer for evaluation.The manufacturer conducted visual inspection and functional test of the devices received by customer.Upon visual inspection of the second device, the two devices were returned in the original packaging.For the second device, the measurements taken show that the acceptance criteria for height difference and gap was achieved.However, epotek is visible between and on the coils which is failure according to visual standard r78.; also, the solder was also missing on the active connection on the pcb.The continuity was still within specification.A dhr review has been performed for the complaint device lot number u2108050; no issues (ncrs or deviations) with the manufacturing process have been indicated which might explain the failures observed.Based on a review of the product ra no containment or correction action related to the individual complaint is required.Despite some variance in the coil heights, the measurements of the spring coils for all 3 returned electrodes were found to be within the manufacturer¿s specification.A defect was observed for in the second device during the investigation, adhesive was visible between the spring coils; it was also noted that the solder on the active wire pcb connection had broken away exposing the internal active wire.This product is subject to a 100% visual tip inspection at process 135 which includes a check for any adhesive visible between coils.The information regarding the excessive adhesive has been shared with the relevant manufacturing team leader and production team members who assemble the product.This information will provide an awareness of the event and describe the potential impact of such an error caused within the manufacturing process.An observation was made of insufficient solder on the active connection to the pcb.Electrical testing shows continuity was still within specification.A capa investigation has already been completed to further investigate similar soldering defects.A correction action from this capa was the retraining operators within cr1 against the current assembly aid 515352 process id 110 fit and solder pcb which should help prevent recurrence of this defect.In addition to the retaining preformed as part of continuous improvement the assembly aid has now been updated with an improved method of soldering.The customers devices were manufactured in sep 2021 which is prior to these corrective actions.At this point in time, in depuy synthes mitek, additional complaint information monitoring for potential safety signals is conducted through complaint trending as part of post market surveillance.Device history lot a dhr review has been performed for the complaint device lot number u2108050; no issues (ncrs or deviations) with the manufacturing process have been indicated which might explain the failures observed.Based on a review of the product ra no containment or correction action related to the individual complaint is required.
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