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Device manufacturing date: device expiration date could not be determined.Device serial number/lot number is unknown.Event problem and evaluation codes: updated.A device history record (dhr) review was conducted which indicated all inspections were completed and no issues were noted during manufacture.A product sample was received for evaluation.Visual and functional testing was performed.Visual inspection found no damages nor other workmanship defects were detected.Functional testing found a leak is observed at the drip chamber.The root cause of the reported issue was found to be a lack of a robust and repeatable adhesive dispensing method, since currently the adhesive application relies on the operators ability to achieve the desired (b)(6) dipping depth.An updated process to add an automated solvent dispenser instead of the current manual process to improve consistency for meeting the process requirements.Closed (b)(6) 2019.Awareness notification to the personal was performed to explain the importance to follow the process for bonding application.Completed (b)(6) 2022.This issue is being monitored via an internal cat.If the occurrence of this issue increases significantly, additional corrective actions will be taken.This remediation mdr was generated under protocol b10010579, as a result of warning letter cms# (b)(4).
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