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The implant remains in the patient.It was used for treatment, not diagnosis.The identifying lot number was not provided; therefore, a review of the device history record could not be conducted.A postoperative radiograph image was provided which confirm the event.Based on the information provided, a root cause could not be determined.If additional information, a supplemental report will be filed accordingly.Warnings: "the system implants are used only to provide temporary internal fixation during the bone fusion process with the assistance of a bone graft.A successful result may not be achieved in every instance of use with these devices.Without solid bone fusion, these devices cannot be expected to support the spine indefinitely and may fail due to bone-metal interface, rod failure or bone failure.Based on the fatigue test results, the physician/surgeon should consider the levels of implantation, patient weight, patient activity level and patient conditions, which may impact the performance of the system when using this device.Use of these systems is significantly affected by the surgeon's proper patient selection, preoperative planning, proper surgical technique, proper selection and placement of implants.Risks identified with the use of these devices, which may require additional surgery, include device component failure, loss of fixation/stabilization, non-union, vertebral fracture, neurological injury, vascular or visceral injury.It is critical that set screws are torqued to the proper values as recommended in this surgical technique guide, using the instruments provided.Failure to tighten the set screw to the recommended torque could compromise the mechanical stability of the connector." "possible adverse effects: the following complications and adverse reactions have been shown to occur with the use of similar spinal instrumentation.These effects and any other known by the surgeon must be discussed with the patient preoperatively.Initial or delayed loosening, disassembly, bending, dislocation and/or breakage of device components.".
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