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The device was not returned for analysis.A review of the production records and corrective or preventive actions (capa) was performed and revealed no indication of a product quality issue.Additionally, a query of the complaint handling database for the reported lot revealed no indication of a lot specific issue.The investigation was unable to determine a conclusive cause for the reported difficulties.It was reported that after unpacking, the distal portion of the wire was noted to have a bend.Factors that may contribute to damage during unpackaging (deformation due to compressive stress) include, but are not limited to, damage incurred during manufacturing, damage incurred during shipment, or inadvertent mishandling during unpacking or preparation.Based on the information provided and because the device was not returned for analysis, it is unknown what may have caused the reported damage during unpackaging (deformation due to compressive stress).Additionally, it was reported that handling of the damaged wire resulted in the reported material separation.There is no indication of a product quality issue with respect to manufacture, design, or labeling; therefore, no product-related corrective action will be implemented in this case.
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