| Catalog Number |
536450 |
| Medical Device Problem Code |
Break (1069)
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| Health Effect - Clinical Code |
No Clinical Signs, Symptoms or Conditions (4582)
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| Date of Event |
10/09/2024
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Type of Reportable Event
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Malfunction
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Additional Manufacturer Narrative
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This report is being submitted pursuant to the provisions of 21 cfr, part 803 (and/or part 4, as applicable).This report may be based on information which has not been investigated or verified prior to the required reporting date.This report does not reflect a conclusion by depuy synthes, or its employees that the report constitutes an admission that the product, depuy synthes, or its employees caused or contributed to the potential event described in this report.If information is obtained that was not available for the initial report, a follow-up report will be filed as appropriate.
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Event or Problem Description
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It was reported that during loan kit inspection on october 9, 2024, the tip of the instrument was chipped.
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Additional Manufacturer Narrative
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Product complaint # (b)(4).Investigation summary: according to the information received, " this instrument is composed of 1 part.The tip of the instrument is chipped as per the images attached." the product was not returned to medtech orthopaedics, however photos were provided for review.See attachment ¿image.Jfif and image (1).Jfif¿.The photo investigation revealed that '536450, s-rom*stem/sleve separtor wedg was broken.The observed condition of the device was consistent with a random component failure that may have been caused by exposure to unintended user error.Since the device was not returned, a dimensional inspection cannot be performed.The overall complaint was confirmed as the observed condition of the s-rom*stem/sleve separtor wedg would contribute to the complained device issue.Based on the investigation findings, it has been determined that no corrective and/or preventative action is proposed.There is no indication that a design or manufacturing issue has caused the complaint condition.As part of medtech orthopaedics quality process, all devices are manufactured, inspected, and released to approved specifications.Additional monitoring for any potential safety signals will be conducted through complaint trending and other post-market safety surveillance activities.Device history lot: the product investigation found no evidence suspecting an error in the manufacturing or material that would be a contributing factor in the reported allegation(s).A manufacturing records evaluation (mre) was not performed.
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Additional Manufacturer Narrative
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Product complaint #:(b)(4).Investigation summary = > according to the information received, " this instrument is composed of 1 part.The tip of the instrument is chipped as per the images attached." the product was not returned to medtech orthopaedics, however photos were provided for review.See attachment ¿image.Jfif and image (1).Jfif¿.The photo investigation revealed that '536450, s-rom*stem/sleve separtor wedg was broken.The observed condition of the device was consistent with a random component failure that may have been caused by exposure to unintended user error.Since the device was not returned, a dimensional inspection cannot be performed.The overall complaint was confirmed as the observed condition of the s-rom*stem/sleve separtor wedg would contribute to the complained device issue.Based on the investigation findings, it has been determined that no corrective and/or preventative action is proposed.There is no indication that a design or manufacturing issue has caused the complaint condition.As part of medtech orthopaedics quality process, all devices are manufactured, inspected, and released to approved specifications.Additional monitoring for any potential safety signals will be conducted through complaint trending and other post-market safety surveillance activities.Device history lot = > the product investigation found no evidence suspecting an error in the manufacturing or material that would be a contributing factor in the reported allegation(s).A manufacturing records evaluation (mre) was not performed.H11 additional narrative: added: d9, g1 (manufacturing site name).
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Additional Manufacturer Narrative
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Product complaint # : (b)(4).Investigation summary : this instrument is composed of 1 part.The tip of the instrument is chipped as per the images attached.The product was returned to j&j medtech orthopaedics for evaluation.Visual inspection of the returned device found the tip was broken.The broken fragment was not returned for evaluation.Potential cause can be attributed to unintended use error by use of excessive force in a prying motion and overload of the material.A functional test was not conducted due to not being applicable to the complaint condition.A dimensional inspection was not conducted due to not being applicable to the complaint condition.The overall complaint was confirmed as the observed condition of the s-rom*stem/sleve separtor wedg would have contributed to the complained device issue.Based on the investigation findings, the potential cause is traced to unintended use, and it has been determined that no corrective and/or preventative action is proposed.There is no indication that a design or manufacturing issue has caused the reported complaint condition.As part of j&j medtech orthopaedics quality process, all devices are manufactured, inspected, and released to approved specifications.Additional monitoring for any potential safety signals will be conducted through complaint trending and other post-market safety surveillance activities.Device history lot: the product investigation found no evidence suspecting an error in the manufacturing or material that would be a contributing factor in the reported allegation(s).A records evaluation (mre) was not performed.
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Search Alerts/Recalls
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