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A visual inspection was performed on the returned device.The reported deformation due to compressive stress was confirmed.A review of the production records and the corrective and preventive actions (capa) database was performed and revealed no indication of a product quality issue.Additionally, a query of the complaint handling database for the reported lot revealed no indication of a lot specific issue.The investigation was unable to determine a conclusive cause for the reported deformation due to compressive stress.It was reported that the guide wire was bent (deformation due to compressive stress) after removal from the packaging.Analysis of the returned wire confirmed the reported deformation on the shaping ribbon.Factors that may contribute to damage during unpackaging include, but are not limited to, damage incurred during manufacturing, damage incurred during shipment, or inadvertent mishandling during unpacking or preparation.In this case, it cannot be determined when the deformation was introduced.It is possible that the deformation occurred during unpackaging, however, this cannot be confirmed.Additionally, the analysis noted a separation of the distal solder tip.This type of separation can occur due to corrosion, when the wire is exposed to environmental factors during return.There is no indication of a product quality issue with respect to manufacture, design, or labeling; therefore, no product-related corrective action will be implemented in this case.
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