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The transmitter assembly associated with the complaint was returned for investigation.Although the report of overheating was not replicated, the investigation found evidence of liquid ingress.The investigation found the unit board was damaged by liquid ingress and will not power on which was the cause of the complaint.The cause is attributed to pcb failure due to liquid damage.Attached to the rma report is a picture that shows the presence of liquid on the board.As a result of the liquid ingress (i.E.Efflorescence, oxidation), multiple circuits were damaged.Additionally, the investigation found a damaged component as l12 was broken.A potential cause could be dropping the device onto hard surface.For the report of overheating: thermal imaging was used to verify the outside temperature of the device while charging, the internal temperature of the device while charging, the outside temperature of the device while operating, and the internal temperature of the device while operating.Results are as follows: outside thermal temperature while charging: 33.7°c.Internal thermal temperature while charging: 40.1°c.Outside thermal temperature while operating: 29.6°c.Internal thermal temperature while operating: 33.2°c.The outside thermal temperature while charging was 33.7°c, which is below the product requirements specification of 41°c (106°f).Based on the thermal imaging, there is no evidence of thermal damage and the product met temperature specifications.Rates reviewed at the most recent complaint trending meeting do not indicate a significant increase in liquid ingress.Liquid ingress rates remain acceptably low; thus, capa is not required.Liquid ingress rates will continue to be tracked and trended.Refer to issue-2025-0004 for additional investigation details and risk assessment for broken l12.
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