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No complaint was received with the return of the device.Failure event observed during analysis.The device was received with normal telemetry and output.Visual inspection of the header attachment area detected a bonding anomaly between the epoxy header and titanium case.A device history record (dhr) review was performed and all required manufacturing processes and inspections steps were confirmed to be completed per the requirements.The device met specifications prior to leaving abbott manufacturing facilities.The device longevity assessment found the device was operating above the elective replacement indicator (eri) voltage, indicating normal usage.Hybrid circuitry was tested, and the results indicated normal current drain.A manufacturing anomaly may have occurred, which resulted in the header bonding anomaly.
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