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Blank fields on this form indicate the information is unknown or unavailable.H3: device evaluation anticipated, but not yet begun.This report includes information known at this time.A follow-up report will be submitted should additional relevant information become available.This report is required by the fda under 21 cfr part 803 and is based on unconfirmed information submitted by others.Neither the submission of this report nor any statement contained herein is intended to be an admission that any cook device is defective or malfunctioned, that a death or serious injury occurred, nor that any cook device caused, contributed to, or is likely to cause or contribute to a death or serious injury if a malfunction occurred.
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As reported, prior to use for an unspecified procedure related to peripheral artery disease, a micropuncture transitionless stiffened cannula access set¿s wire was described as ¿completely frayed¿, ¿deteriorated¿, and ¿disheveled¿, and could not be used.The device did not make patient contact.The patient did not require any additional procedures or experience any adverse effects due to this event.
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Summary of event: as reported, prior to use for an unspecified procedure related to peripheral artery disease, a micropuncture transitionless stiffened cannula access set¿s wire was described as ¿completely frayed¿, ¿deteriorated¿, and ¿disheveled¿, and could not be used.The device did not make patient contact.The patient did not require any additional procedures or experience any adverse effects due to this event.Corrected information: d4 = udi.Investigation evaluation: reviews of the complaint history, device history record (dhr), instructions for use (ifu), and quality control procedures were conducted during the investigation.A visual inspection of the complaint device was also conducted.The prior-to-use complaint device was returned to cook for investigation.The distal tip of the wire was unraveled, just past the solder joint, and the mandril was exposed.The weld ball was present.A document-based investigation evaluation was performed.A review of the device history record found no relevant non-conformances on the final or sub-assembly lots.A review of complaint history found no additional relevant complaints for the final or sub-assembly lots.The product ifu states ¿upon removal from package, inspect the product to ensure that no damage has occurred.¿ a review of the device master record (dmr) concluded that sufficient inspection activities are in place to identify this failure mode prior to distribution.The information provided upon review of the dmr, dhr, and investigation of the returned device suggests that there is evidence the device was manufactured to specification.There is no evidence of non-conforming devices in-house or in the field.Based on the information provided and the results of the investigation, cook has concluded that a component failure contributed to this event.It is unknown when the wire damage occurred, and it is unknown if the user attempted to remove the wire from the wire holder.It is possible that the wire could have been damaged during transport/storage.The wire is supplied to cook by an external supplier.The supplier was notified of the event.The risk analysis for this failure mode was reviewed, and no additional escalation was required.The appropriate personnel have been notified, and cook will continue to monitor for similar events.This report is required by the fda under 21 cfr part 803 and is based on unconfirmed information submitted by others.Neither the submission of this report nor any statement contained herein is intended to be an admission that any cook device is defective or malfunctioned, that a death or serious injury occurred, nor that any cook device caused, contributed to, or is likely to cause or contribute to a death or serious injury if a malfunction occurred.
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