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Additional information: d4, h3, h4, h6 device evaluation: follow-up report submitted to document device evaluation results.The reported breakage could be confirmed according to the visual inspection of the returned devices.The plate failure was caused by overload conditions, with sem analysis revealing both low-cycle fatigue rupture and forced fracture with severe embrittlement.Manufacturing and inspection records showed no issues, and the breakage likely progressed from one side first, reducing stability and leading to complete failure under increased forces.Based on the investigation, there is no indication for an incorrectly working product or any design, material, or manufacturing-related issue.Therefore, no corrective and/or preventive actions are deemed necessary at this time.
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